Process limits you can design against
Each capability page publishes real line limits, material options, and coverage rules so engineering and procurement can lock scope before RFQ.
PCB fabrication with published limits up to 32 layers.
HDI, rigid-flex, heavy copper, and RF stackups with coupon impedance checks and DFM constraints you can use before file release.
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PCBA assembly from 01005 to fine-pitch BGA with test coverage.
SMT and THT assembly with SPI, AOI, X-Ray, ICT/FCT options, plus the manufacturing package rules that prevent avoidable ramp delays.
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Cable harness manufacturing with 100% continuity testing.
From internal jumpers to sealed branched harnesses, with crimp validation, overmolding, and lot-level documentation per release.
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