PCBA assembly from 01005 to fine-pitch BGA with test coverage.

SMT and THT assembly with SPI, AOI, X-Ray, ICT/FCT options, plus the manufacturing package rules that prevent avoidable ramp delays.

SMT assembly

Wave soldering with selective fingers.
Selective soldering for mixed-tech boards with sensitive SMT neighbors.
Manual assembly and rework for BGA, QFN, large connectors and mechanical hardware.
Press-fit insertion with calibrated fixtures.
Bonded heatsinks and stiffeners installed pre- or post-reflow as defined.

Reflow profile validated per BGA package — large body parts have non-trivial thermal lag.
X-Ray sampling configurable from 10% to 100%; we recommend 100% on FCBGA.
Voiding limits enforced per IPC-7095 (typical: < 25% per ball, no joining voids).
Underfill on request — required where the board is exposed to mechanical shock.
Rework supported with documented profile and post-rework X-Ray.

01005 placement requires controlled paste volume — 100% SPI is the only reliable check.
Substrate flatness matters; warped substrate causes graping and tombstoning at high rates.
Pad design should follow IPC-7351 nominal — non-standard pads cause repeatability issues.
Avoid mixing 01005 and through-hole on the same side where possible.

BOM in CSV or XLSX with reference designators, qualified MPN and qualified alternates.
Pick-and-place file (CPL / XY data) with rotation convention and origin clearly noted.
Assembly drawing with top / bottom views, polarity marks, fiducials, mechanical hold-down points.
Conformal coating mask defined as a layer or as a clearly marked drawing — not as a free-text note.
Test plan or FCT script outline; we co-design fixtures from this.
Build instructions for hand-place / post-reflow components.

At least three fiducials per board side, in non-symmetric positions.
Test points exposed on a single side wherever possible.
Component courtyards respected; minimum 0.5 mm between components for hand rework.
Polarity marks on the silkscreen and inside the courtyard.
Tooling / depanelization holes or v-score lines defined; sensitive components kept clear of stress paths.
BGA placement allows enough clearance for X-Ray and rework.

1. Single-source MPN with no alternate — first allocation event blocks the program.
2. Generic part description without an MPN — purchasing cannot resolve at quote time.
3. Mixed reel and tape-and-ammo packaging assumptions — line setup time grows.
4. BOM lines with `0R` resistors that should be DNP — production picks them up unless explicitly marked.
5. Quantity column missing for connectors — assembly drawing and BOM diverge on first article.
6. Polarity-sensitive parts (caps, diodes, LEDs) not marked in the BOM Notes column.

AOI only	Lowest cost; catches most placement and joint defects; misses functional faults.
AOI + X-Ray sampling	Default for BGA-bearing boards; raises sample rate per program.
AOI + Flying Probe	Engineering builds, low / mid volume; no fixture investment.
AOI + ICT (Bed-of-Nails)	High-volume programs; fixture investment justified by repeated runs.
AOI + ICT + FCT	Default for safety-critical or high-margin programs.
FCT only	Possible when topology blocks ICT; coverage trade-off documented.

Turn-key	We source the BOM in full.
Consigned	Customer ships components; we run the line.
Partial consigned	Customer supplies long-lead or specialty components; we source the rest.
BOM-with-substitutions	We propose alternates against a customer-approved list.

Component lead time is usually the dominant factor — especially for active parts on allocation.
Stencil fabrication and first-article setup add ~2–3 working days on a new program.
FCT fixture design and validation add 1–3 weeks depending on test scope.
Conformal coating and potting add a process day per batch.
Programming on the line adds cycle time but rarely affects ship date.

Next step

Send your manufacturing package to start scope review.