Computing PCBA for server boards, accelerators, and PCIe platforms.

High-pin-count BGA assembly, signal-integrity-aware stackups, and serial-level test evidence for server and accelerator production.

16+: layers, high-TG
2,000+: BGA pins per package
100%: X-Ray on critical lots
Per serial: FCT data retention

What we manufacture in this vertical

Server motherboard and dual-socket platform PCBA.

PCIe Gen4 / Gen5 expansion card PCBA.

Edge AI compute module PCBA (with GPU / NPU placement).

Back-plane and storage carrier board PCBA.

OCP-style mezzanine and accelerator carrier PCBA.

Stackup and material context

PCIe Gen5 (32 GT/s) and DDR5 push insertion-loss budgets into the territory where standard FR4 is no longer sufficient. The right material choice is a manufacturing concern as much as a design one.

16+ layer high-TG stackups standard; 20–24 layers common for dual-socket platforms.

Mid-loss FR4 for Gen3 / Gen4 short channels; low-loss for Gen5 and long-channel routes.

Hybrid stackups supported when only a portion of the board is high-speed.

High-pin-count BGA assembly

Reflow profiles validated per BGA package — large body parts have a non-trivial thermal lag.
X-Ray at 100% on critical lots; quantitative voiding measured against IPC-7095 thresholds.
Underfill applied on customer request; required on parts subject to mechanical shock or high CTE mismatch.
Rework supported with documented profile and post-rework X-Ray; BGA placement rules must respect adjacent components for tool clearance.

Power integrity and decoupling — assembly notes

High-density decoupling caps (large counts of small body parts) require disciplined paste deposition; 100% SPI catches early.

Cavity / stitching capacitor placement under BGAs benefits from X-Ray sampling on first article.

Inrush controllers and hot-swap circuits validated under FCT before shipment.

Mechanical and cooling interface manufacturing

Heatsink retention assembly with calibrated torque drivers.

Thermal interface material (TIM) application with controlled thickness; TIM2 supported.

Backplate and stiffener installation.

Mounting hardware kitting per shipment when requested.

What to think about before files arrive

Provide reflow profile constraints if you have them; otherwise we will propose one.
Identify all high-power BGAs explicitly — they drive the profile and the X-Ray plan.
Mark all components that must be hand-placed or post-soldered (post-reflow connectors).
Provide FCT script or test plan; expect us to design the fixture in-house.
Identify mechanical interfaces (heatsinks, brackets) and which side of the line installs them.
Specify TIM and BOM hardware (screws, washers, standoffs) explicitly.

Documentation we produce per program

Reflow profile records per program.

X-Ray reports per lot, with voiding statistics.

FCT logs per serial.

Heatsink torque records per shipment.

Stackup confirmation and impedance reports for high-speed designs.

Common pitfalls we see in computing handoffs

1. Stackup provided as a thickness only — no insertion loss budget, no impedance targets per net class.
2. BGA placement too close to a stiffener — rework requires removing adjacent parts.
3. FCT script delivered after first article ship date — production stalls on validation gating.
4. Mechanical hardware not in BOM — kitting cannot complete on time.
5. TIM type assumed; supplier substitution causes thermal regression on the first system test.

Representative cases

Dual-socket server motherboard — 16-layer high-TG PCB, double-sided BGA, 100% X-Ray.
Edge AI compute module PCBA — thermal and stress validation under sustained load.
PCIe Gen4 network card PCBA — low-loss laminate, controlled-depth drilling, validated SerDes link test.

Next step

Send your manufacturing package to start scope review.